UNCT3100
UNCT3100
Category: NDT X-Ray Equipment
UNCT3100 Benchtop Industrial CT Testing System
Manufacturer: Ray Tech (Malaysia) Sdn Bhd
Description
Manufacturer : Ray Tech (Malaysia) Sdn Bhd
Equipment Introduction : The UNCT3100 is a compact industrial CT inspection system that offers high precision and can be utilised across various industries to meet their specific inspection requirements. It is primarily employed for small metal castings, non-ferrous metals, lithium battery cells, chips, electronic components, rock samples, cores, soils, fossils, composite materials, biological samples and other detection purposes.
Product Features : A benchtop industrial CT system built around a reliable 160kV sealed X-ray source and a high-resolution flat panel detector in a highly compact, integrated cabinet.
Key Features
- Equipped with a reliable 160kV sealed X-ray source and a 3072×3072 pixel matrix flat panel detector.
- Packed into a benchtop-optimised, highly compact layout that integrates a physical operator desk framework into a unified cabinet footprint.
- Supports a 10kg maximum loading capacity with a broad φ500×500mm detection window.
- Features tiered user permission grading, simplified workflow controls, and one-click automated 3D volume slicing.
Function Application

Equipment Features
- Functions: DR and CT dual imaging detection function; 3D scanning, data reconstruction and analysis.
- Safety: High level protection with radiation dose far lower than the national standard, backed by multiple security measures.
- Operation: User-friendly control system design, easy to operate and quick to master after a short training.
- High Cost-Effective: Designed specially for small product inspection, with a highly integrated design, complete functions and a compact structure.
Inspection Images
Dimensions and Appearance
| Footprint | 1600(W)×1240(D)×1850(H)mm |
| Machine Weight | 3000 kg |
| Radiation Dose | Less than 1µSv/h |
| Power Supply | 380V AC, 50Hz |
| Power Consumption | 6 kW |
| Console | Highly Integrated Console |
| X-Ray Tube Type | Sealed |
| Voltage | 160kV |
| Minimum Focal Spot | 0.5mm |
| Power Consumption | 480W |
| Detector | Amorphous Silicon |
| Effective Detection Area | 427×427 mm |
| Pixel Size | 139µm |
| Pixel Matrix | 3072×3072 |
| Max. Detection Range | φ500×500 mm |
| Max. Loading Weight | 10 kg |
| Available Modules | Coordinate measurement, design parts/objects comparison, wall thickness analysis, pore inclusion analysis, fiber composite material analysis, extended version pore/inclusion analysis, manufacturing geometry correction, volume grid calculation, structural mechanics simulation, transfer field simulation and other functions. |
* Specifications are subject to change without notice. All trademarks are the property of the system maker.
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